GemaTEG™ Introduces DaTEG™ 1.0 Thermal Management Solution Accelerating AI Infrastructure

The latest disruptive innovation in GPU & CPU performance enhancement and chip cooling technology maximizes the yield of hyper-scaler and data center operations.

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BELLEVUE, Wash. April 29, 2024 – GemaTEG™, a leader in AI infrastructure advancement, introduces DaTEG™ 1.0. This innovation helps top chip designers in the HPC industry, hyper-scalers, datacenter providers, and systems integrators transcend AI industry limitations by enhancing capacity without increasing resource demands. It is designed to increase server output at the GPU and CPU level materially, dissipate heat more effectively, improve chip cooling, and significantly cut data center energy costs. Leveraging its deep scientific and practical experience in the properties and applications of silicon and with more than five years of development and testing, GemaTEG™ is now live with the differentiated DaTEG™ 1.0 Thermal Management Solution.

“Infrastructure requirements supporting the rapidly intensifying demands of AI computing are in their infancy,” said Maurizio Miozza, Co-founder and Chief Technology Officer of GemaTEG and an Astroparticle physicist by education, who worked on groundbreaking silicon-based detectors for space applications in international collaborations including NASA, New Mexico State University, CERN, and INFN. “DaTEG™ 1.0 represents a significant technological leap by improving cooling requirements from servers at the individual chip level with an advanced control system of chiplet temperature. Moreover, DaTEG™ 1.0, through effective thermal management, not only reduces server operating costs but, more importantly, increases the computational power and output of each chip.  The solution enables chip designers to help hyper-scalers and data center operators optimize their efficiency and effectiveness, improve performance and profitability while maintaining a watchful eye on environmental conservation and sustainability.”

DaTEG™ 1.0 is the initial culmination of decades of physicist and engineering experience in the properties of silicon— the foundation of all chips — with materials sciences and fluid dynamics applications across multiple high-tech industries, including aerospace and nuclear science, to create a comprehensive, scalable solution with maximum efficacy.  

“GemaTEG™, through our DaTEG™ solution, introduces a paradigm shift: from mere cooling to comprehensive thermal management.” continued Maurizio Miozza. “For us, cooling is not the end goal but a means to achieve peak chip performance. Our approach transcends basic temperature reduction, aiming to optimize the operational conditions of the chip for superior functionality and efficiency. Unlike conventional cooling, which limits itself to preventing the chip from "frying", thermal management fine-tunes the temperature to enhance the silicon's performance characteristics.”

The integrated and modular Thermal Management solution combines an innovative, proprietary heat exchanger, a revolutionary micro-heat pump, and a chip-agnostic adaptive control system. The solution requires less server space than current sub-optimal, marketed cooling solutions.

Extensive testing reveals that by deploying DaTEG™ 1.0, achieved performance can reach up to each chip’s designed and advertised GHz potential without risk of overheating. Furthermore, the integrated solution enables data center operators to control the temperature of the chip, regardless of environmental factors such as the temperature of the external water provided by the data center and direct the performance-enhancing cooling technology to the targeted chip within a specific server. This process eliminates unnecessary energy and liquid usage through conventional “one size fits all” cooling applications such as air, liquid / cold plate, and immersion.

GemaTEG™ continues to work with internationally renowned third-party academic institutions and HPC industry advisors to validate and develop its current and next-generation Thermal Management solutions.

“The scalable DaTEG™ 1.0 Thermal Management solution is leading the performance enhancement and cooling improvement charge for chip designs consuming up to 500 watts.  Peering around the corner of even greater future AI infrastructure requirements, subsequent DaTEG™ releases are poised to support chip designs consuming upwards of 1000 watts." concluded Maurizio Miozza. "DaTEG™ takes advantage of a modular architecture that, unlike any other technology, does not require additional space. At GemaTEG™ we are exceptionally proud of the tangible and intangible value we bring to customers while being mindful of the strain AI is placing on our natural resources.”

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About GemaTEG

Accelerating AI Infrastructure. GemaTEG’s Thermal Management solution transcends AI industry limitations by enhancing capacity without increasing resource demands.

Since its founding in 2019, GemaTEG™ has been on a mission to accelerate AI infrastructure by leveraging its deep science exploration and innovation with environmental responsibility to create Thermal Management advancements that materially drive performance, reduce costs, and improve sustainability for all stakeholders.

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Press & Company Contact

Manfred Markevitch

Co-Founder & CEO

GemaTEG Inc.

Email: info@gemateg.com